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相关教师 |
个人基本信息：
唐道胜，男，博士。2014年6月毕业于西北工业大学应用物理学专业，获理学学士学位；后分别于2017年6月和2021年6月获清华大学工程热物理专业硕士和博士学位。2021年8月进入苏州大学轨道交通学院工作至今。
Daosheng Tang, male, Ph.D. in Engineering thermophysics. I obtained my bachelor's degree in applied physics in 2014 from Northwestern Polytechnical University and my Ph.D. degree in engineering thermophysics in 2021 from Tsinghua University. Then, I started to work at Soochow University as a postdoc.
研究介绍：
电子器件近结热管理
电子器件是实现超级计算、智能控制、高效通讯、功率转换应用的重要部件，在轨道交通、新能源汽车、电力输运与转换领域具有重要应用。电子器件的发展趋势主要有高度集成化、特征尺寸不断减小、高功耗器件中功率密度不断增加等。目前，电子器件热管理已成为电子器件设计及维护工作中的重要组成部分，也是传热学一个极具潜力的研究分支。围绕“电子器件热管理”主题，主要在以下两方面开展研究工作：
一、电子器件热管理：热仿真与热优化
目前电子器件散热的核心问题集中在近结点散热，相应的近结点热管理主要包括：
1）芯片级温度场仿真预测；
2）近结点导热调控和优化；
3）嵌入式和电热协同的近结点散热设计。
二、半导体材料的导热性质及其调控方法
电子器件近结点热管理研究的需求和新兴材料（低维材料）的发展推动导热研究向微观层面深入，与物理学、材料科学等深度交叉。研究主要包括：
1）材料热导率的模拟计算和实验测量（第一性原理计算、蒙特卡罗模拟，分子动力学模拟，3-Omega热物性测量等）；
2）半导体材料导热的新奇物理及其在微纳米结构导热调控中的应用（拓扑声子学）。
Research introduction：
Near-junction thermal management in electronics
Electronic devices are important components for realizing supercomputing, intelligent control, high-efficiency communication, and power conversion applications, which are widely applied in the fields of rail transportation, new energy vehicles, and power transmission and conversion. With the continuous increase of the integration, reduction of feature size, and increase of power density in electronics, heat dissipation has become a bottleneck issue for electronic management. As a result, thermal management for electronics become quite essential for engineering applications, which also accelerates the theoretical development of heat transfer physics.
1.Near-junction thermal management in electronics: thermal modeling and optimization
1)Thermal simulations for near-junction regions;
2)Heat conduction manipulation and optimization;
3)Heat dissipation design with microchannels.
2.Heat conduction properties of semiconductors and tuning methods
1)Thermal transport simulations and measurements using the first-principles calculations, Monte Carlo simulations, and 3-Omega methods.
2)New phonon physics for thermal transport tuning, such as topological effects of phonons.
Selected publications：
[1] D.S. Tang, B.Y. Cao. Phonon thermal transport properties of GaN with symmetry-breaking and lattice deformation induced by the electric field. International Journal of Heat and Mass Transfer, 2021, 179: 121659.
[2] D.S. Tang, Y.C. Hua, Y.G. Zhou, B.Y. Cao. Thermal conductivity modeling of GaN films. Acta Physica Sinica, 2021,70(4): 045101.
[3] D.S. Tang, B.Y. Cao. Topological effects of phonons in GaN and AlGaN: A potential perspective for tuning phonon transport. Journal of Applied Physics, 2021, 129: 085102.
[4] D.S. Tang, G.Z. Qin, M. Hu, B.Y. Cao. Thermal transport properties of GaN with biaxial strain and electron-phonon coupling. Journal of Applied Physics, 2020, 127: 035102.
[5] D.S. Tang, Y.C. Hua, B.D. Nie, B.Y. Cao. Phonon wave propagation in ballistic-diffusive regime. Journal of Applied Physics, 2016, 119: 124301.
Full publications：https://www.researchgate.net/profile/Daosheng-Tang/research
(updated in 2021.10.14)
个人基本信息：
唐道胜，男，博士。2014年6月毕业于西北工业大学应用物理学专业，获理学学士学位；后分别于2017年6月和2021年6月获清华大学工程热物理专业硕士和博士学位。2021年8月进入苏州大学轨道交通学院工作至今。
Daosheng Tang, male, Ph.D. in Engineering thermophysics. I obtained my bachelor's degree in applied physics in 2014 from Northwestern Polytechnical University and my Ph.D. degree in engineering thermophysics in 2021 from Tsinghua University. Then, I started to work at Soochow University as a postdoc.
研究介绍：
电子器件近结热管理
电子器件是实现超级计算、智能控制、高效通讯、功率转换应用的重要部件，在轨道交通、新能源汽车、电力输运与转换领域具有重要应用。电子器件的发展趋势主要有高度集成化、特征尺寸不断减小、高功耗器件中功率密度不断增加等。目前，电子器件热管理已成为电子器件设计及维护工作中的重要组成部分，也是传热学一个极具潜力的研究分支。围绕“电子器件热管理”主题，主要在以下两方面开展研究工作：
一、电子器件热管理：热仿真与热优化
目前电子器件散热的核心问题集中在近结点散热，相应的近结点热管理主要包括：
1）芯片级温度场仿真预测；
2）近结点导热调控和优化；
3）嵌入式和电热协同的近结点散热设计。
二、半导体材料的导热性质及其调控方法
电子器件近结点热管理研究的需求和新兴材料（低维材料）的发展推动导热研究向微观层面深入，与物理学、材料科学等深度交叉。研究主要包括：
1）材料热导率的模拟计算和实验测量（第一性原理计算、蒙特卡罗模拟，分子动力学模拟，3-Omega热物性测量等）；
2）半导体材料导热的新奇物理及其在微纳米结构导热调控中的应用（拓扑声子学）。
Research introduction：
Near-junction thermal management in electronics
Electronic devices are important components for realizing supercomputing, intelligent control, high-efficiency communication, and power conversion applications, which are widely applied in the fields of rail transportation, new energy vehicles, and power transmission and conversion. With the continuous increase of the integration, reduction of feature size, and increase of power density in electronics, heat dissipation has become a bottleneck issue for electronic management. As a result, thermal management for electronics become quite essential for engineering applications, which also accelerates the theoretical development of heat transfer physics.
1.Near-junction thermal management in electronics: thermal modeling and optimization
1)Thermal simulations for near-junction regions;
2)Heat conduction manipulation and optimization;
3)Heat dissipation design with microchannels.
2.Heat conduction properties of semiconductors and tuning methods
1)Thermal transport simulations and measurements using the first-principles calculations, Monte Carlo simulations, and 3-Omega methods.
2)New phonon physics for thermal transport tuning, such as topological effects of phonons.
Selected publications：
[1] D.S. Tang, B.Y. Cao. Phonon thermal transport properties of GaN with symmetry-breaking and lattice deformation induced by the electric field. International Journal of Heat and Mass Transfer, 2021, 179: 121659.
[2] D.S. Tang, Y.C. Hua, Y.G. Zhou, B.Y. Cao. Thermal conductivity modeling of GaN films. Acta Physica Sinica, 2021,70(4): 045101.
[3] D.S. Tang, B.Y. Cao. Topological effects of phonons in GaN and AlGaN: A potential perspective for tuning phonon transport. Journal of Applied Physics, 2021, 129: 085102.
[4] D.S. Tang, G.Z. Qin, M. Hu, B.Y. Cao. Thermal transport properties of GaN with biaxial strain and electron-phonon coupling. Journal of Applied Physics, 2020, 127: 035102.
[5] D.S. Tang, Y.C. Hua, B.D. Nie, B.Y. Cao. Phonon wave propagation in ballistic-diffusive regime. Journal of Applied Physics, 2016, 119: 124301.
Full publications：https://www.researchgate.net/profile/Daosheng-Tang/research
(updated in 2021.10.14)
