朴明浩,男,博士,副教授,硕士生导师,苏州大学优秀青年学者。2009年毕业于韩国忠北大学生物信息学系获硕士学位。2014年毕业于韩国忠北大学计算机科学系获博士学位。2014年09月~2015年08月在韩国忠北大学担任讲师,2015年09月~2017年06月在韩国东国大学庆州分校担任研究助理教授,2017年07月~2020年03月在韩国忠北大学计算机科学系担任客座助理教授。2020年09月加入苏州大学计算机科学与技术学院,参与人工智能系和机器学习课题组的各项科研与教学工作。在学习和工作期间,重点主持参与过5个纵向项目和多个横向项目。现/曾担任IEEE Transactions on Industrial Informatics, IEEE Transactions on Semiconductor Manufacturing, ACM Transactions on Knowledge Discovery from Data, Advanced Engineering Informatics, Journal of Intelligent Manufacturing 等国际期刊的审稿人。
目前主要研究方向包括:数据挖掘,多模态学习,模式识别。已在国际权威的期刊和各种学术会议上发表相关文章近70篇,以第一作者和通讯作者发表20多篇。包括ACM Transactions on Information Systems, ACM Transactions on Knowledge Discovery from Data, IEEE Transactions on Power Systems, Bioinformatics,Journal of Intelligent Manufacturing, IEEE Transactions on Semiconductor Manufacturing等国际期刊。
近年发表的论文目录(近年中科院2区以上命中率约80%):
[1]Kanglin Jin; Mengtong Guo;Minghao Piao*:High-order Spatial-Frequency Interaction and Detail Compensation Network for infrared and visible image fusion, Elsevier Infrared Physics & Technology, 2026, 155, 106431(中科院2区期刊)
[2]Kanglin Jin; Mengtong Guo;Minghao Piao*:Spatial-frequency complementary fusion with multi-level feature ensemble for infrared and visible image fusion, Elsevier Digital Signal Processing, 2026, 175, 105992(中科院3区期刊)
[5]Yi Sheng; Jinda Yan; Minghao Piao*: Improved Wafer Map Defect Pattern Classification Using Automatic Data Augmentation Based Lightweight Encoder Network in Contrastive Learning, Journal of Intelligent Manufacturing, 2024: 1 – 13 (中科院2区期刊)
[6]Minghao Piao; Yi Sheng; Jinda Yan; Cheng Hao Jin: Image Hash Layer Triggered CNN Framework for Wafer Map Failure Pattern Retrieval and Classification, ACM Transactions on Knowledge Discovery from Data, 2024, 18(4): 1-26(CCF B类期刊)
[7]Minghao Piao; Cheng Hao Jin; Baojiang Zhong: Antecedent Hash Modality Learning and Representation for Enhanced Wafer Map Defect Pattern Recognition,Elsevier Expert System with Application, 2024, 250, 123914 (中科院1区期刊)
[8]Jinda Yan; Yi Sheng; Minghao Piao*: Semantic Segmentation Based Wafer Map Mixed-Type Defect Pattern Recognition, IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems, 2023, 42(11): 4065-4074(CCF A类期刊)
[9]Minghao Piao; Cheng Hao Jin: CNN And Ensemble Learning Based Wafer Map Failure Pattern Recognition Based on Local Property Based Features, Journal of Intelligent Manufacturing, 2023, 34(8): 3599-3621(中科院1区Top期刊)
[10]Minghao Piao; Cheng Hao Jin: Analysis of Image Hashing in Wafer Map Failure Pattern Recognition, IEEE Transactions on Semiconductor Manufacturing, 2023, 36(3): 378 – 388(SCIE-2区期刊,中科院3区)
[11]Cheng Hao Jin; Hyun-Jin Kim; Yongjun Piao; Meijing Li; Minghao Piao*: Wafer Map Defect Pattern Classification based on Convolutional Neural Network Features and Error-Correcting Output Codes, Journal of Intelligent Manufacturing, 2020, 31(8): 1861-1875(中科院1区Top期刊)
